Coverart for item
The Resource High temperature fatigue behavior of tungsten copper composites, Michael J. Verrilli, Yonk-Suk Kim, and Timothy P. Gabb ; prepared for the Symposium on Fundamental Relationships Between Microstructure and Mechanical Properties of Metal-Matrix Composites cosponsored by the Metallurgical Society and the American Society for Metals, Indianapolis, Indiana, October 1-5, 1989, (microform)

High temperature fatigue behavior of tungsten copper composites, Michael J. Verrilli, Yonk-Suk Kim, and Timothy P. Gabb ; prepared for the Symposium on Fundamental Relationships Between Microstructure and Mechanical Properties of Metal-Matrix Composites cosponsored by the Metallurgical Society and the American Society for Metals, Indianapolis, Indiana, October 1-5, 1989, (microform)

Label
High temperature fatigue behavior of tungsten copper composites
Title
High temperature fatigue behavior of tungsten copper composites
Statement of responsibility
Michael J. Verrilli, Yonk-Suk Kim, and Timothy P. Gabb ; prepared for the Symposium on Fundamental Relationships Between Microstructure and Mechanical Properties of Metal-Matrix Composites cosponsored by the Metallurgical Society and the American Society for Metals, Indianapolis, Indiana, October 1-5, 1989
Creator
Contributor
Subject
Language
eng
Member of
Additional physical form
Also available via Internet from the NASA Technical Report Server web site. Address as of 2/14/06: http://ntrs.nasa.gov/archive/nasa/casi.ntrs.nasa.gov/19900011822%5F1990011822.pdf; current access available via PURL.
Cataloging source
OKX
http://library.link/vocab/creatorName
Verrilli, Michael J
Government publication
federal national government publication
Illustrations
illustrations
Index
no index present
Literary form
non fiction
Nature of contents
  • bibliography
  • technical reports
http://library.link/vocab/relatedWorkOrContributorDate
1958-
http://library.link/vocab/relatedWorkOrContributorName
  • Kim, Yonk-Suk
  • Gabb, Timothy Paul
  • United States
Series statement
NASA technical memorandum
Series volume
102404
http://library.link/vocab/subjectName
  • Metallic composites
  • Copper alloys
  • Fiber composites
  • High temperature
  • Metal fibers
  • Metal matrix composites
  • Thermal fatigue
  • Thermodynamics
  • Tungsten alloys
Label
High temperature fatigue behavior of tungsten copper composites, Michael J. Verrilli, Yonk-Suk Kim, and Timothy P. Gabb ; prepared for the Symposium on Fundamental Relationships Between Microstructure and Mechanical Properties of Metal-Matrix Composites cosponsored by the Metallurgical Society and the American Society for Metals, Indianapolis, Indiana, October 1-5, 1989, (microform)
Link
http://purl.access.gpo.gov/GPO/LPS66893
Instantiates
Publication
Note
  • Cover title
  • Shipping list no.: 90-0857-M
  • "E-5156"--P. [1]
Base of film
safety base undetermined
Bibliography note
Includes bibliographical references (pages 9-11)
Carrier category
microfiche
Carrier category code
he
Carrier MARC source
rdacarrier
Color
black and white
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Control code
ocm25194412
Dimensions
4x6 in. or 11x15 cm.
Emulsion on film
diazo
Extent
16 pages
Form of item
microfiche
Generation
service copy
Media category
microform
Media MARC source
rdamedia
Media type code
h
Other physical details
illustrations.
Positive negative aspect
negative
http://bibfra.me/vocab/marc/reductionRatio
02
ReductionRatioRange
normal reduction
Reproduction note
Microfiche.
Specific material designation
microfiche
Stock number
N 90-21138
System control number
  • (GPO)99184661
  • (OCoLC)25194412
  • (GPO)99184661
  • (Sirsi) a856633
Label
High temperature fatigue behavior of tungsten copper composites, Michael J. Verrilli, Yonk-Suk Kim, and Timothy P. Gabb ; prepared for the Symposium on Fundamental Relationships Between Microstructure and Mechanical Properties of Metal-Matrix Composites cosponsored by the Metallurgical Society and the American Society for Metals, Indianapolis, Indiana, October 1-5, 1989, (microform)
Link
http://purl.access.gpo.gov/GPO/LPS66893
Publication
Note
  • Cover title
  • Shipping list no.: 90-0857-M
  • "E-5156"--P. [1]
Base of film
safety base undetermined
Bibliography note
Includes bibliographical references (pages 9-11)
Carrier category
microfiche
Carrier category code
he
Carrier MARC source
rdacarrier
Color
black and white
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Control code
ocm25194412
Dimensions
4x6 in. or 11x15 cm.
Emulsion on film
diazo
Extent
16 pages
Form of item
microfiche
Generation
service copy
Media category
microform
Media MARC source
rdamedia
Media type code
h
Other physical details
illustrations.
Positive negative aspect
negative
http://bibfra.me/vocab/marc/reductionRatio
02
ReductionRatioRange
normal reduction
Reproduction note
Microfiche.
Specific material designation
microfiche
Stock number
N 90-21138
System control number
  • (GPO)99184661
  • (OCoLC)25194412
  • (GPO)99184661
  • (Sirsi) a856633

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